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| Original Our Product (Coating Specifications) |
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| Original Our Product (Design/Manufacture of Apparatuses) |
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NIPPON FUSSO CO.,LTD.
2-4-6, Mokuzaidori, Miharaku,
Sakai, Osaka
Postal Code: 587-0042
TEL +81-72-361-3391
FAX +81-72-363-1230 |
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HOME ＞ Products ＞ Problems solved by fluoropolymer coating ＞ Application ＞ Semiconductor manufacturing device
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Semiconductor manufacturing device |
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Metal free fluoropolymer coating
Highly pure fluoropolymer coating prevents device contamination from metal ion elution.
Elution test data
■Elution test results from sample test pot |
Unit: ppb |
| Na |
Mg |
Al |
K |
Tl |
Cr |
Fe |
Ni |
Cu |
Zn |
| <0.5 |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
Film thickness: 300μm
Coating specification: NF-036SP
Substrate: SUS-304
Elution test conditions: 36%HCI RT 1Week
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Advantage of Application: No.1
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Less contamination on surface |
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Particle reduction |
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Less silicon wafer edge damage |
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Advantage of Application: No. 2
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Prevents external contamination due to chemical permeation |
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Mechanical strength is available for using metal vessel. |
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Improves thermal conduction efficiency |
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Advantage of Application: No. 3
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Prevents external contamination due to chemical permeation |
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Mechanical strength is available for using metal vessel. |
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Improves thermal conduction efficiency |
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Improved strength for resin molded items
Advantage of Application
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Enables use of metal structured materials |
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Allows the securing of machine accuracy through secondary processing |
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Measures for high mechanical strength required parts |
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CMP equipment
Advantage of Application
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Prevents equipment deterioration from corrosive fluids or corrosive atmospheres |
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Prevents cross contamination from CMP slurry sticking |
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Improved washability |
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Exhaust line
Advantage of Application
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Prevents corrosion from etching gas |
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Reduces sticking of depot matter |
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Silicon wafer edge damage decreases |
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| Tokyo |
Osaka（head office） |
| TEL.+81-3-3688-3237 |
TEL.+81-72-361-3391 |
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